2014-07-27 00:04
我們將Layout進行仿真，可看出圖中電流密度頗高，這會使得PCB板過熱，導致於電壓降過大，使銅承受過大的電流，嚴重將可能燒板...
We simulate layout which find the region that is high current density, it is be over-hot and it reduce voltage drop, it possible be burn over if it carried higher current...
我們將Layout進行修改，可看出圖中電流密度密集高的區域已降低，可讓銅不會因為過高的電流密度而燒損~
That picture can shown it be reduce high current density region after we modify layout, it can not burn-over that we do.
